ONLINEMEETING
DC Fast
Charging Solutions
We use cookies to analyse the views of our website and for personalized advertising. By using our website, you agree to such analysis. More information.
Charging the Future
DC/DC Product Portfolio
For the DC-DC power conversion stage mainly isolated topologies are employed like the full-bridge or three-phase LLC resonant converter, and the full-bridge phase-shift DAB. The first one is a pure frequency modulated configuration and the second operates with PWM.
In this stage, SiC MOSFET chip technology is essential to meeting switching frequency (>100 kHz) and peak efficiency (>98.5%) requirements. A 1200 V SiC MOSFET streamlines the topology by transitioning from a two cascaded interleaved LLC with 650V Si components to a single full-bridge LLC.
LLC
DAB
Three-Phase LLC
Product Portfolio
Select and learn more about ...
- Vincotech fastPACK Products
- fastPACK E2 SiC
- fastPACK S3 SiC
Vincotech fastPACK Products
Vincotech fastPACK SiC product line is offering a comprehensive product portfolio with H-bridge (full-bridge), featuring:
- Latest generation and multiple sourced 650 V and 1200 V chip technologies, e.g. IGBT, SiC MOSFET, Si fast diode, SiC SBD for high switching and high efficiency
- Integrated DC capacitor
- Open emitter configuration
- Kelvin emitter for improved switching performance
- Temperature sensor
| Housing | H-bridge | 2ph Ultrafast Rectifier | 3ph Ultrafast Rectifier |
|---|---|---|---|
| flow 0 |
650 V - show products
1200 V - show products
|
650 V - show products
|
|
| flow 0 SiC |
1200 V - show products
900 V - show products
650 V - in concept
|
650 V - show products |
|
| flow 1 | 650 V - show products
1200 V - show products |
650 V - show products
1200 V - show products |
650 V - show product |
| flow 1 SiC | 650 V - show products
1200 V - show products |
||
| flow E1 SiC |
1200 V - show products
650 V - in concept
|
1200 V - show products
|
|
| flow E2 SiC |
1200 V - show products
|
1200 V - show product |
|
| flow S3 SiC |
1200 V - show products
|
fastPACK E2 SiC - 10-EY124PA016ME01-LP49F16T
10-EY124PA016ME01-LP49F16T
Features
- Latest generation SiC MOSFET Gen3
- Kelvin emitter for improved switching performance
- AlN Substrate for enhanced thermal performance
- Industry standard pinout
- Solder pin or Press-fit pins for solder less connection to PCB
- Pre-applied PC-TIM rated for 150°C
- Temperature sensor
Benefits
- Superior module efficiency which enables system cost advantages
- System efficiency improvement for reduced cooling requirements
- Enabling higher frequency to increase power density
fastPACK S3 SiC
B0-SP12ORA080RO-LM90J48T
Features
- Latest generation SiC SBD for high switching and high efficiency
- Optional w/ or w/o discharge switch
- VINcoPress technology aimed for superior thermal performance with improved reliability
- Temperature sensor
- Solder pin or Press-fit pins for solder less connection to PCB
- Pre-applied PC-TIM rated for 150°C
Benefits
- Superior module efficiency which enables system cost advantages
- Ready for 400 V and 800 V battery systems