AC/DC Product Portfolio

 

There are several three-phase PFC topologies available which can be addressed with multiple 3L and 2L topologies with pros and cons in terms of efficiency, costs and design complexity.

 

Each of these topologies will influence

  • the blocking voltage rating of the semiconductors e.g. 650 V or 1200 V and as a result, the switching losses and the efficiency
  • the total system costs, e.g. PFC inductor size and costs
  • the thermal management, e.g. heat sink size
  • the design e.g. uni- or bi-directional. For bi-directional charging the 3L SPFC and NPFC are suitable by replacing the boost diodes with switches, and the 2L sixpack per se

Product Portfolio

Select and learn more about ...

  • 3L topologies
  • Vincotech Products for 3L topologies
  • Product Highlights for 3L topologies
  • 2L topologies
  • Vincotech Products for 2L topologies
  • Product Highlight for 2L topologies

3L topologies

Vincotech Products for 3L PFC Topologies

With the flowNPFC/MNPC, flowANPFC, and flowSPFC Vincotech offers a comprehensive product portfolio for 3L PFC topologies, featuring:

  • Latest generation and multiple sourced 650 V fast IGBT or SiC MOSFET chip technology for high-speed switching and high efficiency
  • 1200 V fast recovery diodes or SiC Schottky body diodes for uni-directional solutions or 1200 V SiC MOSFETs for bi-directional solutions
  • Optional integrated DC capacitors and gate resistors
  • Temperature sensor
Housing MNPC SiC NPFC /
3xNPFC
ANPFC /
3xANPFC
SPFC Application Power*
flow 0 - Show products Show products Show products Up to 30 kW
flow 1 Show products Show products flowANPFC 1 SiC
in concept
flowSPFC 1 SiC
in concept
Up to 60 kW
flow 2 - - Show products - Up to 30 kW
flow E2 Show products - - - Up to 60 kW
flow E3 flow3xMNPC E3 SiC
in concept
flow3xNPFC E3 SiC
in concept
- - Up to 50 kW


* Estimation based on a typical charger operation point

Product Highlights for 3L PFC Topologies

flowNPFC/MNPC 1 SiC product line - for application power up to 60 kW

New optimized pin-out features

  • Shorter DC+ to GND and DC- to GND distance
  • Lower stray inductance
  • Optimal commutation loops
  • Symmetrical and short commutation loops with balanced operation in pos and neg half period
  • Symmetrical gate commutation loops
  • Easy to add separated gate resistance

10-FY07LBA100S5-PG08J58T

  • For uni-directional chargers
  • Cost efficient hybrid solution with 650 V Trenchstop™ 5 IGTB and 1200 V SiC boost diode

 

10-PY07LBA015ME-PG08J68T

  • For uni-directional chargers
  • High efficiency SiC solution with 650 V SiC MOSFET and 1200 V SiC boost diode

 

10-PY12NMD016ME-PG08F18T

  • For bi-directional chargers
  • High efficiency solution with 650 V/1200 V SiC MOSFET

 

2L topologies

Vincotech Products for 2L PFC Topologies

With the flowPACK SiC and flowDUAL SiC, Vincotech offers a broad product portfolio for 2L PFC topologies, featuring:

  • Latest generation and multiple sourced 1200 V/650 V SiC-MOSFET chip technology for high speed switching and high efficiency
  • Kelvin Emitter for improved switching performance
  • High power low inductive package
  • Temperature sensor
Housing Half-bridge Sixpack Application Power *
flow 1 - Show products Up to 30 kW
flow E1 Show products Show products Up to 40 kW
flow E2 Show products Show products Up to 80 kW
flow S3 flowDUAL S3 SiC
in concept
- Up to 120 kW
flow E3 Show products - Up to 150 kW


* Estimation based on a typical charger operation point

Product Highlight for 2L PFC Topologies

flowDUAL E3 SiC - for application power up to 150 kW

B0-EP122PA002ME-PG88F18T

 

Features
  • Latest generation SiC MOSFET Gen3
  • High power density for compact designs
  • Very symmetrical internal chip layout
  • Kelvin emitter for improved switching performance
  • Industry standard pinout
  • VINcoPress technology aimed for superior thermal performance with improved reliability
  • Temperature sensor
  • Solder pin or Press-fit pins for solder less connection to PCB
  • Pre-applied PC-TIM rated for 150° C
Benefits
  • Outstanding, ≥99% conversion efficiency brings down overall costs
  • Low stray inductance and symmetrical chip layout enable higher switching frequency and lower system costs
  • Greater supply chain security with
    • the new flow E3 industry standard-compatible housing (CTI >600)
    • the latest multi-sourced SiC devices
  • Excellent thermal performance with VINcoPress technology to decrease junction temperature and increase lifetime
  • Pre-applied PC-TIM rated for 150° C helps reduce production cost